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New Radient eV-CXP for 3D Profiling

Matrox®  Imaging have announced the Matrox Radient eV-CXP for 3D Profiling, featuring on-board 3D profiling using patented Matrox technology. The new Radient frame grabber offers the flexibility to work with any cameras using the CoaXPress®  interface standard, enabling new 3D profiling possibilities for very high resolution cameras.

 

Capable of extracting 9,000 profiles per second from an image size of 2048x128 pixels with no host CPU usage, the Radient eV-CXP for 3D profiling is ideal for use in inspection tasks in PCB production, road and rail maintenance, and both perishable and non-perishable food analysis for example.

 

The Matrox Radient eV-CXP provides four independent CXP links through the required BNC connectors. This allows for simultaneous capture from up to four cameras each running at different CXP speeds. For high-bandwidth applications, the frame grabber can also capture from a single camera transmitting image data at up to 25 Gbps using link aggregation.

 

For the most demanding applications, ClearView Imaging offers an extensive range of very high resolution, high speed CoaXPress® cameras that can be used with the new Radient eV-CXP to tackle the most complex challenges in 3D profiling.

 

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